CONTINECT Modules
Introduction
Former Fujitsu Electronics, under its new name KAGA FEI, is part of KAGA Electronics. The below mentioned products are part of the KAGA FEI strategy to enrich the product and service portfolio to better meet customers requirements. Utilizing KAGA FEI is experience in HW and SW development also for wireless technologies in combination with the KAGA Electronics EMS capabilities, KAGA FEI will not just maintain the existing portfolio but development new products to meet future customer requirements.
In October 2021 Taiyo Yuden and KAGA FEI agreed to transfer the Taiyo Yuden BT and WLAN module business to KAGA FEI. As of January 1th 2022 following this agreement KAGA FEI will become the owner of the BT and WLAN module business. Moving forward all former Taiyo Yuden products will still be available under their Taiyo Yuden part number and will be produced without changes.
Don’t hesitate to contact us per mail (info@eu.kagafei.com) or via our form and feel free to visit our Online Webshop
Wireless Solutions
KAGA FEI pursue miniaturization, low power consumption, and high functionality (embedded software) in each product. KAGA FEI also provides a lineup of many variations that customers can choose from based on their application needs.
For more details, please contact us via our inquiry page.
Bluetooth Module
- Bluetooth® low energy (BLE) Basic Module
- Bluetooth® low energy (BLE) Application Embedded Module
| Part Number | Feature | Dimension(mm) | Bluetooth® Ver. | Chip Set | Soft device | RAM | Flash | Interface | CPU | Crystal | Operaion Temp.(℃) | ANT support | Certification | Sensor Node Development Kit | Evaluation Board | Evaluation Kit | Overview | Data Report |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
EYSKBNZWB | High-end | 10.0x15.4x2.0 | v5.0 | nRF52840 | S140_x000D_ V6.1.0 | 256KB | 1MB | USB UART SPI I2C I2S PDM NFC-A | ARM_x000D_ Cortex_x000D_ M4F | 32MHz_x000D_ 32.768kHz | -40 to +85 | # | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | - | EBSKBNZWB | EKSKBNZWB | V3.1 | V1.0 |
EYSKDNZWB | High Performance Antenna | 9.6x12.9x1.3 | v5.0 | nRF52840 | S140 V6.1.0 | 256KB | 1MB | USB UART SPI I2C I2S PDM NFC-A | ARM Cortex M4F | 32MHz | -40 to +85 | # | Japan U.S.A. Canada (CE) Bluetooth® Logo | - | EBSKDNZWB | EKSKDNZWB | V3.1 | V1.0 |
EYSKJNZWB | High-end | 5.1x11.3x1.3 | v5.0 | nRF52840 | S140 V6.1.0 | 256KB | 1MB | UART SPI I2C I2S PDM NFC-A | ARM Cortex M4F | 32MHz | -40 to +85 | # | - | EY1SENSOR-KIT _x000D_ EY1SENSOR-SKT | EBSKJNZWB | EKSKJNZWB | V3.1 | V1.1 |
EYSPBNZUA | Low cost | 10×15.4×2.0 | v5.2 | nRF52833 | S140 V7.0.1 | 128kB | 512kB | USB UART SPI I2C I2S PDM NFC-A | ARM Cortex M4F | 32MHz 32.768kHz | -40 to +105 | # | Japan U.S.A. Canada (CE) Bluetooth® Logo | - | EBSPBNZUA | EKSPBNZUA | V3.1 | V1.0 |
EYSHCNZWZ | High Performance | 9.6x12.9x2.0 | v5.0 | nRF52832 | S132 V5.0.0 | 64KB | 512KB | UART SPI I2C I2S PDM NFC-A | ARM Cortex M4F | 32MHz 32.768kHz | -40 to +85 | * | Japan U.S.A. Canada (CE) Bluetooth® Logo | EY1SENSOR-KIT_x000D_ EY1SENSOR-SKT | EBSHCNZWZ | EKSHCNZWZ | V3.1 | V1.4 |
| EYSHJNZWZ | High Performance | 5.1x11.3x1.3 | v5.0 | nRF52832 | S132 V5.0.0 | 64KB | 512KB | UART SPI I2C I2S PDM NFC-A | ARM Cortex M4F | 32MHz | -40 to +85 | * | Japan U.S.A. Canada (CE) Bluetooth® Logo | EY1SENSOR-KIT_x000D_ EY1SENSOR-SKT | EBSHJNZWZ | EKSHJNZWZ | V3.1 | V1.5 |
EYSHSNZWZ | High Performance | 3.25x8.55x0.85 | v5.0 | nRF52832 | S132 V5.0.0 | 64KB | 512KB | UART SPI I2C I2S PDM NFC-A | ARM Cortex M4F | 32MHz | -40 to +85 | * | Japan U.S.A. Canada (CE) Bluetooth® Logo | EY1SENSOR-KIT_x000D_ EY1SENSOR-SKT | EBSHSNZWZ | EKSHSNZWZ | V3.1 | V1.5 |
EYSNCNZWW | Low cost | 9.6x12.9x2.0 | v5.2 | nRF52811 | S113_x000D_ V7.0.1 | 24KB | 192KB | UART_x000D_ SPI_x000D_ I2C_x000D_ PDM | ARM_x000D_ Cortex_x000D_ M4 | 32MHz_x000D_ 32.768kHz | -40 to +85 | * | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EY1SENSOR-KIT_x000D_ EY1SENSOR-SKT | EBSNCNZWW | EKSNCNZWW | V3.1 | V1.0 |
| EYSNSNZWW | Low cost | 3.25×8.55×1.00 | v5.2 | nRF52811 | S113_x000D_ V7.0.1 | 24KB | 192KB | UART_x000D_ SPI_x000D_ I2C_x000D_ PDM | ARM_x000D_ Cortex_x000D_ M4 | 32MHz | -40 to +85 | * | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EY1SENSOR-KIT_x000D_ EY1SENSOR-SKT | EBSNSNZWW | EKSNSNZWW | V3.1 | V1.0 |
EYSLCNZWW | Low cost | 9.6x12.9x2.0 | v5.0 | nRF52810 | S112_x000D_ V5.1.0 | 24KB | 192KB | UART_x000D_ SPI_x000D_ I2C_x000D_ PDM | ARM_x000D_ Cortex_x000D_ M4 | 32MHz_x000D_ 32.768kHz | -40 to +85 | * | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EY1SENSOR-KIT_x000D_ EY1SENSOR-SKT | EBSLCNZWW | EKSLCNZWW | V3.1 | V1.1 |
| EYSLSNZWW | Low cost | 3.25x8.55x1.00 | v5.0 | nRF52810 | S112_x000D_ V5.1.0 | 24KB | 192KB | UART_x000D_ SPI_x000D_ I2C_x000D_ PDM | ARM_x000D_ Cortex_x000D_ M4 | 32MHz | -40 to +85 | * | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EY1SENSOR-KIT_x000D_ EY1SENSOR-SKT | EBSLSNZWW | EKSLSNZWW | V3.1 | V1.0 |
| EYSGCNZWY | Simple | 9.6x12.9x2.0 | v4.2 | nRF51822 | S120 V2.1.0 | 32KB | 256KB | UART SPI I2C | ARM Cortex M0 | 32MHz 32.768kHz | -25 to +85 | - | Japan U.S.A. Canada (CE) Bluetooth® Logo | - | EBSGCNZWY | EKSGCNZWY | V3.1 | V1.9 |
| EYSGCNZXX | Simple | 9.6x12.9x2.0 | v4.2 | nRF51822 | S110_x000D_ V8.0.0 | 16KB | 256KB | UART_x000D_ SPI_x000D_ I2C | ARM_x000D_ Cortex_x000D_ M0 | 32MHz_x000D_ 32.768kHz | -40 to +85 | - | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | - | EBSGCNZWY | EKSGCNZWY | V3.1 | V1.9 |
| EYSGJNZWY | Simple | 5.1x11.3x1.3 | v4.2 | nRF51822 | S120_x000D_ V2.1.0 | 32KB | 256KB | UART_x000D_ SPI_x000D_ I2C | ARM_x000D_ Cortex_x000D_ M0 | 32MHz | -25 to +85 | - | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | - | EBSGJNZWY | EKSGJNZWY | V3.1 | V2.0 |
| EYSGJNZXX | Simple | 5.1x11.3x1.3 | v4.2 | nRF51822 | S110 V8.0.0 | 16KB | 256KB | UART SPI I2C | ARM Cortex M0 | 32MHz | -40 to +85 | - | Japan U.S.A. Canada (CE) Bluetooth® Logo | - | EBSGJNZWY | EKSGJNZWY | V3.1 | V2.0 |
| EYAGJNZXX | Simple | 5.1x11.3x1.3 | v4.2 | nRF51422 | S310_x000D_ V3.0.0 | 32KB | 256KB | UART_x000D_ SPI_x000D_ I2C | ARM_x000D_ Cortex_x000D_ M0 | 32MHz | -25 to +85 | ✓ | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | - | EBAGJNZXX | EKAGJNZXX | V3.1 | V2.0 |
EYSGCCAXW | Dual mode | 10×15.4×2.0 | v5.0 | - | - | 56KB | 2MB | UART | 16-bit_x000D_ RISC_x000D_ 80MHz MCU | 26MHz | -40 to +85 | - | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | - | EBSGCCAXW | - | V1.1 | V1.0 |
# Supported by S340 Softdevice
* Supported by S212 or S332 Softdevice
✓ Supported by default Softdevice
For more details, please contact us via our inquiry page.
| Part Number | Feature | Dimension(mm) | Bluetooth® Ver. | Chip Set | Soft device | Application | I/F | CPU | Crystal | DCDC | Operaion Temp.(℃) | Certification | Evaluation Board | Overview | Data Report |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EYSKBNUWB-VX(Under Development) | Application Embedded | 10.0x15.4x2.0 | v5.0 | nRF52840 | S140_x000D_ V6.1.0 | Embedded TY's Application | USB_x000D_ UART_x000D_ SPI | ARM_x000D_ Cortex_x000D_ M4F | 32MHz_x000D_ 32.768kHz | Supported_x000D_ with_x000D_ Internal LC | -40 to +85 | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EBSKBNUWB-VX | - | V0.91 |
| EYSKJNAWB-VX(Under Development) | Application Embedded | 5.1x11.3x1.3 | v5.0 | nRF52840 | S140_x000D_ V6.1.0 | Embedded TY's Application | UART | ARM_x000D_ Cortex_x000D_ M4F | 32MHz | Supported_x000D_ with_x000D_ External LC | -40 to +85 | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EBSKJNAWB-VX | - | V0.91 |
| EYSGCNAWY-VX | Application Embedded | 9.6x12.9x2.0 | v4.2 | nRF51822 | S130_x000D_ V2.0.1 | Embedded TY's Application | UART | ARM_x000D_ Cortex_x000D_ M0 | 32MHz_x000D_ 32.768kHz | Suppoted_x000D_ with_x000D_ Internal LC | -25 to +85 | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EBSGCNAWY-VX | V3.1 | V1.2 |
| EYSGJNAWY-VX | Application Embedded | 5.1x11.3x1.3 | v4.2 | nRF51822 | S130_x000D_ V2.0.1 | Embedded TY's Application | UART | ARM_x000D_ Cortex_x000D_ M0 | 32MHz | Suppoted_x000D_ with_x000D_ External LC | -25 to +85 | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE)_x000D_ Bluetooth®_x000D_ Logo | EBSGJNAWY-VX | V3.1 | V1.2 |
For more details, please contact us via our inquiry page.
Wireless LAN Module
- Wireless LAN & Comb Module
| Part Number | Dimension(mm) | I/F | Crystal | Operaion Temp.(℃) | Certification | IEEE Spec | Bluetooth® Ver. | Antenna | Evaluation Board | Evaluation Kit | Overview | Data Report |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
WYSBHVGXG | 12.6 x 8.9 x 1.9 | SDIO, PCM | Yes | -30 to 85 | None | 802.11 ac/a/b/g/n | V4.2 | No | WBSBHVGXG | WKSBHVGXG | V1.2 | V1.4 |
WYSAGVDXG | 24.0 x 11.5 x2.0 | SDIO, PCM | Yes | -30 to 85 | Japan_x000D_ U.S.A._x000D_ Canada_x000D_ (CE) | 802.11 ac/a/b/g/n | V4.2 | Yes | WBSAGVDXG | WKSAGVDXG | V1.2 | V1.5 |
WYSEGVDXG | 24.0 x 11.5 x2.0 | SDIO, PCM | Yes | -30 to 85 | Japan_x000D_ U.S.A._x000D_ Canada | 802.11 ac/a/b/g/n | V4.2 | RF Connector | WBSEGVDXG | WKSEGVDXG | V1.2 | V1.4 |
WYSACVLAY-XZ | 21.4 x 14.0 x 2.4 | UART_x000D_ SPI | Cortex-M4F | -30 to 85 | Japan_x000D_ U.S.A._x000D_ Canada | IEEE802.11b/g/n | / | / | WBSACVLAY-XZ | WKSACVLAY-XZ | v1.1 | V1.0 |
For more details, please contact us via our inquiry page.
Supplier Profile
Company overview
- Company name: KAGA FEI Co.,Ltd.
- Foundation: May 2, 1952
- Headquarters: 2-100-45, Shin-Yokohama, Kohoku-Ku, Yokohama-shi, Kanagawa, 222-8508Japan
Phone: 045-473-8030 Fax: 045-415-5870 - Products: Design, development, and sales of electronic devices
- Company home page: https://www.kagafei.com/jp/eng/