Introduction

Former Fujitsu Electronics, under its new name KAGA FEI, is part of KAGA Electronics. The below mentioned products are part of the KAGA FEI strategy to enrich the product and service portfolio to better meet customers requirements. Utilizing KAGA FEI is experience in HW and SW development also for wireless technologies in combination with the KAGA Electronics EMS capabilities, KAGA FEI will not just maintain the existing portfolio but development new products to meet future customer requirements.

In October 2021 Taiyo Yuden and KAGA FEI agreed to transfer the Taiyo Yuden BT and WLAN module business to KAGA FEI. As of January 1th 2022 following this agreement KAGA FEI will become the owner of the BT and WLAN module business. Moving forward all former Taiyo Yuden products will still be available under their Taiyo Yuden part number and will be produced without changes.

 

Don’t hesitate to contact us per mail (info@eu.kagafei.com) or via our form and feel free to visit our Online Webshop

 

Wireless Solutions

KAGA FEI pursue miniaturization, low power consumption, and high functionality (embedded software) in each product. KAGA FEI also provides a lineup of many variations that customers can choose from based on their application needs.

For more details, please contact us via our inquiry page.

Bluetooth Module

  • Bluetooth® low energy (BLE) Basic Module
  • Bluetooth® low energy (BLE) Application Embedded Module

 

Part NumberFeatureDimension(mm)Bluetooth® Ver.Chip SetSoft deviceRAMFlashInterface CPUCrystalOperaion Temp.(℃)ANT supportCertificationSensor Node Development KitEvaluation BoardEvaluation KitOverviewData Report
EYSKBNZWB
High-end10.0x15.4x2.0v5.0nRF52840S140_x000D_
V6.1.0
256KB1MBUSB UART SPI I2C I2S PDM NFC-AARM_x000D_
Cortex_x000D_
M4F
32MHz_x000D_
32.768kHz
-40 to +85#Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
-EBSKBNZWBEKSKBNZWBV3.1V1.0
EYSKDNZWB
High Performance Antenna9.6x12.9x1.3v5.0nRF52840S140 V6.1.0256KB1MBUSB UART SPI I2C I2S PDM NFC-AARM Cortex M4F32MHz-40 to +85#Japan U.S.A. Canada (CE) Bluetooth® Logo-EBSKDNZWBEKSKDNZWBV3.1V1.0
EYSKJNZWB
High-end5.1x11.3x1.3v5.0nRF52840S140 V6.1.0256KB1MBUART SPI I2C I2S PDM NFC-AARM Cortex M4F32MHz-40 to +85#-EY1SENSOR-KIT _x000D_
EY1SENSOR-SKT
EBSKJNZWBEKSKJNZWBV3.1V1.1
EYSPBNZUA
Low cost10×15.4×2.0v5.2nRF52833S140 V7.0.1128kB512kBUSB UART SPI I2C I2S PDM NFC-AARM Cortex M4F32MHz 32.768kHz-40 to +105#Japan U.S.A. Canada (CE) Bluetooth® Logo-EBSPBNZUAEKSPBNZUAV3.1V1.0
EYSHCNZWZ
High Performance9.6x12.9x2.0v5.0nRF52832S132 V5.0.064KB512KBUART SPI I2C I2S PDM NFC-AARM Cortex M4F32MHz 32.768kHz-40 to +85*Japan U.S.A. Canada (CE) Bluetooth® LogoEY1SENSOR-KIT_x000D_
EY1SENSOR-SKT
EBSHCNZWZEKSHCNZWZV3.1V1.4
EYSHJNZWZ
High Performance5.1x11.3x1.3v5.0nRF52832S132 V5.0.064KB512KBUART SPI I2C I2S PDM NFC-AARM Cortex M4F32MHz-40 to +85*Japan U.S.A. Canada (CE) Bluetooth® LogoEY1SENSOR-KIT_x000D_
EY1SENSOR-SKT
EBSHJNZWZEKSHJNZWZV3.1V1.5
EYSHSNZWZ
High Performance3.25x8.55x0.85v5.0nRF52832S132 V5.0.064KB512KBUART SPI I2C I2S PDM NFC-AARM Cortex M4F32MHz-40 to +85*Japan U.S.A. Canada (CE) Bluetooth® LogoEY1SENSOR-KIT_x000D_
EY1SENSOR-SKT
EBSHSNZWZEKSHSNZWZV3.1V1.5
EYSNCNZWW
Low cost9.6x12.9x2.0v5.2nRF52811S113_x000D_
V7.0.1
24KB192KBUART_x000D_
SPI_x000D_
I2C_x000D_
PDM
ARM_x000D_
Cortex_x000D_
M4
32MHz_x000D_
32.768kHz
-40 to +85*Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EY1SENSOR-KIT_x000D_
EY1SENSOR-SKT
EBSNCNZWWEKSNCNZWWV3.1V1.0
EYSNSNZWW
Low cost3.25×8.55×1.00v5.2nRF52811S113_x000D_
V7.0.1
24KB192KBUART_x000D_
SPI_x000D_
I2C_x000D_
PDM
ARM_x000D_
Cortex_x000D_
M4
32MHz-40 to +85*Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EY1SENSOR-KIT_x000D_
EY1SENSOR-SKT
EBSNSNZWWEKSNSNZWWV3.1V1.0
EYSLCNZWW
Low cost9.6x12.9x2.0v5.0nRF52810S112_x000D_
V5.1.0
24KB192KBUART_x000D_
SPI_x000D_
I2C_x000D_
PDM
ARM_x000D_
Cortex_x000D_
M4
32MHz_x000D_
32.768kHz
-40 to +85*Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EY1SENSOR-KIT_x000D_
EY1SENSOR-SKT
EBSLCNZWWEKSLCNZWWV3.1V1.1
EYSLSNZWW
Low cost3.25x8.55x1.00v5.0nRF52810S112_x000D_
V5.1.0
24KB192KBUART_x000D_
SPI_x000D_
I2C_x000D_
PDM
ARM_x000D_
Cortex_x000D_
M4
32MHz-40 to +85*Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EY1SENSOR-KIT_x000D_
EY1SENSOR-SKT
EBSLSNZWWEKSLSNZWWV3.1V1.0
EYSGCNZWY
Simple9.6x12.9x2.0v4.2nRF51822S120 V2.1.032KB256KBUART SPI I2CARM Cortex M032MHz 32.768kHz-25 to +85-Japan U.S.A. Canada (CE) Bluetooth® Logo-EBSGCNZWYEKSGCNZWYV3.1V1.9
EYSGCNZXX
Simple9.6x12.9x2.0v4.2nRF51822S110_x000D_
V8.0.0
16KB256KBUART_x000D_
SPI_x000D_
I2C
ARM_x000D_
Cortex_x000D_
M0
32MHz_x000D_
32.768kHz
-40 to +85-Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
-EBSGCNZWYEKSGCNZWYV3.1V1.9
EYSGJNZWY
Simple5.1x11.3x1.3v4.2nRF51822S120_x000D_
V2.1.0
32KB256KBUART_x000D_
SPI_x000D_
I2C
ARM_x000D_
Cortex_x000D_
M0
32MHz-25 to +85-Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
-EBSGJNZWYEKSGJNZWYV3.1V2.0
EYSGJNZXX
Simple5.1x11.3x1.3v4.2nRF51822S110 V8.0.016KB256KBUART SPI I2CARM Cortex M032MHz-40 to +85-Japan U.S.A. Canada (CE) Bluetooth® Logo-EBSGJNZWYEKSGJNZWYV3.1V2.0
EYAGJNZXX
Simple5.1x11.3x1.3v4.2nRF51422S310_x000D_
V3.0.0
32KB256KBUART_x000D_
SPI_x000D_
I2C
ARM_x000D_
Cortex_x000D_
M0
32MHz-25 to +85✓Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
-EBAGJNZXXEKAGJNZXXV3.1V2.0
EYSGCCAXW
Dual mode10×15.4×2.0v5.0--56KB2MBUART16-bit_x000D_
RISC_x000D_
80MHz MCU
26MHz-40 to +85-Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
-EBSGCCAXW-V1.1V1.0

# Supported by S340 Softdevice
* Supported by S212 or S332 Softdevice
✓ Supported by default Softdevice

 

For more details, please contact us via our inquiry page.

 

 

Part NumberFeatureDimension(mm)Bluetooth® Ver.Chip SetSoft deviceApplicationI/FCPUCrystalDCDCOperaion Temp.(℃)CertificationEvaluation BoardOverviewData Report
EYSKBNUWB-VX(Under Development)
Application Embedded10.0x15.4x2.0v5.0nRF52840S140_x000D_
V6.1.0
Embedded TY's ApplicationUSB_x000D_
UART_x000D_
SPI
ARM_x000D_
Cortex_x000D_
M4F
32MHz_x000D_
32.768kHz
Supported_x000D_
with_x000D_
Internal LC
-40 to +85Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EBSKBNUWB-VX-V0.91
EYSKJNAWB-VX(Under Development)
Application Embedded5.1x11.3x1.3v5.0nRF52840S140_x000D_
V6.1.0
Embedded TY's ApplicationUARTARM_x000D_
Cortex_x000D_
M4F
32MHzSupported_x000D_
with_x000D_
External LC
-40 to +85Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EBSKJNAWB-VX-V0.91
EYSGCNAWY-VX
Application Embedded9.6x12.9x2.0v4.2nRF51822S130_x000D_
V2.0.1
Embedded TY's ApplicationUARTARM_x000D_
Cortex_x000D_
M0
32MHz_x000D_
32.768kHz
Suppoted_x000D_
with_x000D_
Internal LC
-25 to +85Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EBSGCNAWY-VXV3.1V1.2
EYSGJNAWY-VX
Application Embedded5.1x11.3x1.3v4.2nRF51822S130_x000D_
V2.0.1
Embedded TY's ApplicationUARTARM_x000D_
Cortex_x000D_
M0
32MHzSuppoted_x000D_
with_x000D_
External LC
-25 to +85Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)_x000D_
Bluetooth®_x000D_
Logo
EBSGJNAWY-VXV3.1V1.2

For more details, please contact us via our inquiry page.

Wireless LAN Module

  • Wireless LAN & Comb Module

 

Part NumberDimension(mm)I/FCrystalOperaion Temp.(℃)CertificationIEEE SpecBluetooth® Ver.AntennaEvaluation BoardEvaluation KitOverviewData Report
WYSBHVGXG
12.6 x 8.9 x 1.9SDIO, PCMYes-30 to 85None802.11 ac/a/b/g/nV4.2NoWBSBHVGXGWKSBHVGXGV1.2V1.4
WYSAGVDXG
24.0 x 11.5 x2.0SDIO, PCMYes-30 to 85Japan_x000D_
U.S.A._x000D_
Canada_x000D_
(CE)
802.11 ac/a/b/g/nV4.2YesWBSAGVDXGWKSAGVDXGV1.2V1.5
WYSEGVDXG
24.0 x 11.5 x2.0SDIO, PCMYes-30 to 85Japan_x000D_
U.S.A._x000D_
Canada
802.11 ac/a/b/g/nV4.2RF ConnectorWBSEGVDXGWKSEGVDXGV1.2V1.4
WYSACVLAY-XZ
21.4 x 14.0 x 2.4UART_x000D_
SPI
Cortex-M4F-30 to 85Japan_x000D_
U.S.A._x000D_
Canada
IEEE802.11b/g/n//WBSACVLAY-XZWKSACVLAY-XZv1.1V1.0

For more details, please contact us via our inquiry page.

Supplier Profile

Company overview

  • Company name: KAGA FEI Co.,Ltd.
  • Foundation: May 2, 1952
  • Headquarters: 2-100-45, Shin-Yokohama, Kohoku-Ku, Yokohama-shi, Kanagawa, 222-8508Japan
    Phone: 045-473-8030 Fax: 045-415-5870
  • Products: Design, development, and sales of electronic devices
  • Company home page: https://www.kagafei.com/jp/eng/