PCBs
Double-Sided PCB
- Technology
- Applications
- Capabilities
Rigid PCB: Double-Sided PCB
Double-sided PCBs are the most cost-effective PCB technologies based on standard FR4 base material throughout the electronics sectors.
- The cheapest, simplest, and fastest PCB technology
- Low degree of complexity
- Available as PCB samples or mass production scales
We gladly support you in any phase of your PCB project. Contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
• Industrial Electronics
• Auto, Medical & Aerospace
• Consumer Electronics
Rigid PCB: Double-Sided PCB Capabilities
- Max panel size SS/DS: 500 mm x 2 350 mm
- PCB thickness: 0.25 mm – 10.0 mm
- Copper thickness: 9 µm – 420 µm
- Minimum Width/Space: 60 µm / 60 µm
- Smallest Drill Diameter (mech): 0.10 mm
- Aspect Ratio: 1:16
Solder masks:
- Available as UV-sensitive and/or thermal hardening inks/paints
- Colours (matte or glossy): Green, Red, Blue, Black, White
Surface finish:
- ENIG
- ENEPIG / EPIG
- OSP
- Imm Sn
- Imm Ag
- HAL leaded / lead free
- Copper-Sn-plating
- Soft-Gold plating
- Hard-Gold plating
- Platinum plating
- Selective / Mixed finish
Showed values represent the maximum capability and may be limited to use in specific combination only.
For more detail information to our PCB capabilities, please contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
Multilayers PCB
- Technology
- Applications
- Capabilities
Rigid PCB: Multilayers PCB
Multilayer PCBs can be found in every electronics sector and the number of layers we can offer you ranges from 4 to 80, with a maximum thickness of 10.0mm.
The interlayer connection is usually designed as plated through hole (PTH) and/or as buried via hole (BVH).
- PCBs up to 80layer
- High variety of available materials
- Available as PCB samples or mass production scales
We gladly support you in any phase of your PCB project. Contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
• Industrial Electronics
• Auto, Medical & Aerospace
• Consumer Electronics
Capabilities
| maximum Layer | up to 80 |
| maximum Board size | 1 092mm x 660mm |
| maximum Board thickness | 10.0mm |
| minimum Board thickness | 0.30mm |
| minimum Core thickness | 0.05mm |
| maximum Copper thickness | 12oz / 420µm |
| minimum Track width/space | 0.05mm/0.05mm |
| minimum drill diameter | 0.20mm |
| Aspect Ratio | 15:1 |
| Impedance Control tolerance | up to ± 5% |
| Solder gap | 0.05mm |
| PCB technologies | asymmetric/symmetric IMS PCB |
| High-Frequency PCB | |
| Embedded Magnetic Core PCB | |
| 4layer PTFE-PCB | |
| Hybrid structures |
| Solder masks | UV-sensitive and/or Thermal hardening |
| Colours | Green |
| Red | |
| Blue | |
| Black | |
| White |
| Surface finishes | ENIG / Electroless Ni, Immersion Au |
| ENEPIG / Electroless Ni, Electroless Pd, Immersion Au | |
| EPIG / Electroless Pd, Immersion Au | |
| Gold plating („Gold Finger“, Hard or Soft Gold, Flash Gold | |
| HASL Lead Free or Leaded | |
| Immersion Silver | |
| Immersion Tin | |
| OSP / Organic Solderability Preservative | |
| Platinum plating | |
| Copper-Tin plating | |
| Mixed finishes available |
Showed values represent the maximum capability and may be limited to use in specific combination only.
For more detail information to our PCB capabilities, please contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
HDI-/SBU-PCB
- Technology
- Applications
- Capabilities
Rigid PCB: HDI-/SBU-PCB
High Density Interconnect (HDI) PCB or Sequential Build Up (SBU) PCB are used in high variety of applications in all electronics industries.
We can offer full range of technologies, from 4-layer laser to 7+n+7 HDI/SBU multilayer in up to 8.0mm PCB thickness.
- High Density Interconnection / Sequential Build Up for maximum packing density and miniaturization.
- PCBs up to 80layer
- High variety of available materials
- Available as PCB samples or mass production scales
We gladly support you in any phase of your PCB project. Please contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
• Industrial Electronics
• Auto, Medical & Aerospace
• Consumer Electronics
Capabilities
| maximum Layer | up to 80 | |
| HDI sequential build up | up to 7+N+7 | |
| maximum Board size | 535mm x 660mm | |
| maximum Board thickness | 8.0mm | |
| minimum Dielectric thickness | 0.025mm | 25µm |
| minimum Core thickness | 0.03mm | 30µm |
| Copper thickness | 3µm to 420µm | |
| minimum Track width/space | 0.03mm/0.03mm | 30µm/30µm |
| minimum mechanical drill diameter | 0.05mm | 50µm |
| – mechanical depth control | ±0.005mm | ± 5µm |
| minimum laser drill diameter | 0.04mm | 40µm |
| Aspect Ratio | 32:1 | |
| Impedance Control tolerance | up to ± 5% | |
| Solder gap | up to 0.03mm | up to 30µm |
| PCB technologies | Every Layer Interconnect / Anylayer |
| Hybrid structures |
|
Solder masks |
UV-sensitive and/or Thermal hardening |
| Colours | Green |
| Red | |
| Blue | |
| Black | |
| White |
| Surface finishes | ENIG / Electroless Ni, Immersion Au |
| ENEPIG / Electroless Ni, Electroless Pd, Immersion Au | |
| EPIG / Electroless Pd, Immersion Au | |
| Gold plating („Gold Finger“, Hard or Soft Gold, Flash Gold | |
| HASL Lead Free or Leaded | |
| Immersion Silver | |
| Immersion Tin | |
| OSP / Organic Solderability Preservative | |
| Platinum plating | |
| Copper-Tin plating | |
| Mixed finishes available |
Showed values represent the maximum capability and may be limited to use in specific combination only.
For more detail information to our PCB capabilities, please contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
Rigid-Flex PCB
- Technology
- Applications
- Capabilities
Rigid-Flex PCB
Rigid-Flex PCBs offer a perfect solution if multiple rigid PCB need to be electrically connected in various positions and orientations.
• Industrial Electronics
• Auto, Medical & Aerospace
• Consumer Electronics
Capabilities
| maximum flex Layer | > 20 |
| maximum Board size | 910mm x 610mm |
| maximum Board thickness | 8.0mm |
| minimum Dielectric thickness | 0.025mm |
| minimum Core thickness | 0.03mm |
| Copper thickness | 3µm to 420µm |
| minimum Track width/space | 0.03mm/0.03mm |
| minimum mechanical drill diameter | 0.05mm |
| – mechanical depth control | ±0.005mm |
| minimum laser drill diameter | 0.04mm |
| Aspect Ratio | 16:1 |
| Impedance Control tolerance | up to ± 5% |
| Solder gap | up to 0.03mm |
| PCB technologies | HDI/SBU Rigid-Flex |
| Solder masks | UV-sensitive and/or Thermal hardening |
| Colours | Green |
| Red | |
| Blue | |
| Black | |
| White |
| Surface finishes | ENIG / Electroless Ni, Immersion Au |
| ENEPIG / Electroless Ni, Electroless Pd, Immersion Au | |
| EPIG / Electroless Pd, Immersion Au | |
| Gold plating („Gold Finger“, Hard or Soft Gold, Flash Gold | |
| HASL Lead Free or Leaded | |
| Immersion Silver | |
| Immersion Tin | |
| OSP / Organic Solderability Preservative | |
| Platinum plating | |
| Copper-Tin plating | |
| Mixed finishes available |
Showed values represent the maximum capability and may be limited to use in specific combination only.
For more detail information to our PCB capabilities, please contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
Suppliers PCB Samples
- Suntak
For more detail information to our PCB capabilities, please contact our Expert-Team via our inquiry form or PCB@eu.kagafei.com.
Other technologies
- Total Flex PCB
- Backplane PCB
- Heavy Copper PCB
- Embedded Capacitance/Impedance Board
- Ceramic based PCB
- Al-based PCB (LED PCB)
- Copper-based (LED PCB)
- MLO PCB / Interposer PCB
- Anylayer / ELIC
Capabilities upon request via our inquiry form or PCB@eu.kagafei.com.
FICT Technologies
If you are interested into Fujitsu Interconnect Technologies (FICT) PCBs, please have a look on this page: https://www.fujitsu.com/jp/group/fict/en/. We are a Value Added Distributor of FICT PCBs so don’t hesitate to come back to us if you any questions or needs via our contact form.
How to buy PCBs
Please send us your your detailed PCB requirements through our inquiry form or via PCB@eu.kagafei.com so that we can produce your needed printed circuit boards that completely meet your requirements. If you do not know how to tell us about your needs, please carefully read our guidelines below.
Starting Requirements and Specifications
(1) Extended Gerber data for all artwork layers
(2) Aperture list or lists for all layers
(3) Drill file in Gerber or Excellon format
(4) Drawings:
- Print should be hard copy or Gerber HPGL or DXF format
- Board dimensions and tolerances
- Datum points
- Overall thickness / Multi-layer detail stacking
- Hole sizes
(5) Special notes or “Read Me” file pertaining to:
- Color / type of solder-mask
- Color of silkscreen
- Plating finish (copper, nickel or gold)
- Dielectrics
- Controlled impedance
- Other special requirements or instructions
Standards and Specifications
IPC-A-600 Acceptability of Printed Wiring Boards (default class 2)
IPC-6011 Generic Performance Specification for Printed Wiring Boards
IPC-6012 Qualification and Performance specs. (default class 2)
IPC-TM-650 Test methods manual.
IPC-SM-840 Qualification and Performance of permanent polymer coatings
IPC-4101 Specification for base materials rigid / multi-layer
MIL-PFR-55110 Military Performance and Specifications-Tucson
IPC-6018 Microwave End Product Board Inspection and Test-Tucson
Please send us your inquiry through our inquiry form or via email to PCB@eu.kagafei.com