Double-Sided PCB

  • Technology
  • Applications
  • Capabilities

Rigid PCB: Double-Sided PCB

Double-sided PCBs are the most cost-effective PCB technologies based on standard FR4 base material throughout the electronics sectors.

  • The cheapest, simplest, and fastest PCB technology
  • Low degree of complexity
  • Available as PCB samples or mass production scales

We gladly support you in any phase of your PCB project. Contact our Expert-Team here.

• Industrial Electronics

• Auto, Medical & Aerospace

• Consumer Electronics

Rigid PCB: Double-Sided PCB Capabilities

  • Max panel size SS/DS: 500 mm x 2 350 mm
  • PCB thickness: 0.25 mm – 10.0 mm
  • Copper thickness: 9 µm – 420 µm
  • Minimum Width/Space: 60 µm / 60 µm
  • Smallest Drill Diameter (mech): 0.10 mm
  • Aspect Ratio: 1:16

Solder masks:

  • Available as UV-sensitive and/or thermal hardening inks/paints
  • Colours (matte or glossy): Green, Red, Blue, Black, White

Surface finish:

  • ENIG
  • ENEPIG / EPIG
  • OSP
  • Imm Sn
  • Imm Ag
  • HAL leaded / lead free
  • Copper-Sn-plating
  • Soft-Gold plating
  • Hard-Gold plating
  • Platinum plating
  • Selective / Mixed finish

Showed values represent the maximum capability and may be limited to use in specific combination only.

For more detail information to our PCB capabilities please contact our Expert-Team here.

Multilayers PCB

  • Technology
  • Applications
  • Capabilities

Rigid PCB: Multilayers PCB

Multilayer PCBs can be found in every electronics sector and the number of layers we can offer you ranges from 4 to 80, with a maximum thickness of 10.0mm.

The interlayer connection is usually designed as plated through hole (PTH) and/or as buried via hole (BVH).

  • PCBs up to 80layer
  • High variety of available materials
  • Available as PCB samples or mass production scales

We gladly support you in any phase of your PCB project. Contact our Expert-Team here.

Courtesy of Suntak

 • Industrial Electronics

• Auto, Medical & Aerospace

• Consumer Electronics

Capabilities

maximum Layer up to 80
maximum Board size 1 092mm x 660mm
maximum Board thickness 10.0mm
minimum Board thickness 0.30mm
minimum Core thickness 0.05mm
maximum Copper thickness 12oz / 420µm
minimum Track width/space 0.05mm/0.05mm
minimum drill diameter 0.20mm
Aspect Ratio 15:1
Impedance Control tolerance up to ± 5%
Solder gap 0.05mm

 

PCB technologies asymmetric/symmetric IMS PCB
High-Frequency PCB
Embedded Magnetic Core PCB
4layer PTFE-PCB
Hybrid structures
Multilayers rigid plate / Courtesy of Suntak

Multilayers rigid plate / Courtesy of Suntak

Solder masks UV-sensitive and/or Thermal hardening
 Colours Green
Red
Blue
Black
White

 

Surface finishes ENIG / Electroless Ni, Immersion Au
ENEPIG / Electroless Ni, Electroless Pd, Immersion Au
EPIG / Electroless Pd, Immersion Au
Gold plating („Gold Finger“, Hard or Soft Gold, Flash Gold
HASL Lead Free or Leaded
Immersion Silver
Immersion Tin
OSP / Organic Solderability Preservative
Platinum plating
Copper-Tin plating
Mixed finishes available

Showed values represent the maximum capability and may be limited to use in specific combination only.

For more detail information to our PCB capabilities please contact our Expert-Team here.

HDI-/SBU-PCB

  • Technology
  • Applications
  • Capabilities

Rigid PCB: HDI-/SBU-PCB

High Density Interconnect (HDI) PCB or Sequential Build Up (SBU) PCB are used in high variety of applications in all electronics industries.
We can offer full range of technologies, from 4-layer laser to 7+n+7 HDI/SBU multilayer in up to 8.0mm PCB thickness.

  • High Density Interconnection / Sequential Build Up for maximum packing density and miniaturization.
  • PCBs up to 80layer
  • High variety of available materials
  • Available as PCB samples or mass production scales

We gladly support you in any phase of your PCB project. Contact our Expert-Team here.

• Industrial Electronics

• Auto, Medical & Aerospace

• Consumer Electronics

Capabilities

maximum Layer up to 80
HDI sequential build up up to 7+N+7
maximum Board size 535mm x 660mm
maximum Board thickness 8.0mm
minimum Dielectric thickness 0.025mm 25µm
minimum Core thickness 0.03mm 30µm
Copper thickness 3µm to 420µm
minimum Track width/space 0.03mm/0.03mm 30µm/30µm
minimum mechanical drill diameter 0.05mm 50µm
 – mechanical depth control ±0.005mm ± 5µm
minimum laser drill diameter 0.04mm 40µm
Aspect Ratio 32:1
Impedance Control tolerance up to ± 5%
Solder gap up to 0.03mm up to 30µm

 

PCB Technologies:

Solder masks UV-sensitive and/or Thermal hardening
 Colours Green
Red
Blue
Black
White

 

Surface finishes ENIG / Electroless Ni, Immersion Au
ENEPIG / Electroless Ni, Electroless Pd, Immersion Au
EPIG / Electroless Pd, Immersion Au
Gold plating („Gold Finger“, Hard or Soft Gold, Flash Gold
HASL Lead Free or Leaded
Immersion Silver
Immersion Tin
OSP / Organic Solderability Preservative
Platinum plating
Copper-Tin plating
Mixed finishes available

Showed values represent the maximum capability and may be limited to use in specific combination only.

For more detail information to our PCB capabilities please contact our Expert-Team here.

Rigid-Flex PCB

  • Technology
  • Applications
  • Capabilities

Rigid-Flex PCB

Rigid-Flex PCBs offer a perfect solution if multiple rigid PCB need to be electrically connected in various positions and orientations.

Rigid-Flex BCP
Courtesy of Somacis

• Industrial Electronics

• Auto, Medical & Aerospace

• Consumer Electronics

Capabilities

maximum flex Layer > 20
maximum Board size 910mm x 610mm
maximum Board thickness 8.0mm
minimum Dielectric thickness 0.025mm
minimum Core thickness 0.03mm
Copper thickness 3µm to 420µm
minimum Track width/space 0.03mm/0.03mm
minimum mechanical drill diameter 0.05mm
 – mechanical depth control ±0.005mm
minimum laser drill diameter 0.04mm
Aspect Ratio 16:1
Impedance Control tolerance up to ± 5%
Solder gap up to 0.03mm
PCB technologies HDI/SBU Rigid-Flex

 

Solder masks UV-sensitive and/or Thermal hardening
 Colours Green
Red
Blue
Black
White

 

Surface finishes ENIG / Electroless Ni, Immersion Au
ENEPIG / Electroless Ni, Electroless Pd, Immersion Au
EPIG / Electroless Pd, Immersion Au
Gold plating („Gold Finger“, Hard or Soft Gold, Flash Gold
HASL Lead Free or Leaded
Immersion Silver
Immersion Tin
OSP / Organic Solderability Preservative
Platinum plating
Copper-Tin plating
Mixed finishes available

Other technologies

  • Total Flex PCB
  • Backplane PCB
  • Heavy Copper PCB
  • Embedded Capacitance/Impedance Board
  • Ceramic based PCB
  • Al-based PCB (LED PCB)
  • Copper-based (LED PCB)
  • MLO PCB / Interposer PCB
  • Anylayer / ELIC

Capabilities upon request via our inquiry form or PCB@eu.kagafei.com.

FICT Technologies

If you are interested into Fujitsu Interconnect Technologies (FICT) PCBs, please have a look on this page: https://www.fujitsu.com/jp/group/fict/en/. We are a Value Added Distributor of FICT PCBs so don’t hesitate to come back to us if you any questions or needs via our contact form.

How to buy PCBs

Please send us your your detailed PCB requirements through our inquiry form or via PCB@eu.kagafei.com so that we can produce your needed printed circuit boards that completely meet your requirements. If you do not know how to tell us about your needs, please carefully read our guidelines below.

Starting Requirements and Specifications

(1) Extended Gerber data for all artwork layers

(2) Aperture list or lists for all layers

(3) Drill file in Gerber or Excellon format

(4) Drawings:

  • Print should be hard copy or Gerber HPGL or DXF format
  • Board dimensions and tolerances
  • Datum points
  • Overall thickness / Multi-layer detail stacking
  • Hole sizes

(5) Special notes or “Read Me” file pertaining to:

  • Color / type of solder-mask
  • Color of silkscreen
  • Plating finish (copper, nickel or gold)
  • Dielectrics
  • Controlled impedance
  • Other special requirements or instructions

Standards and Specifications

IPC-A-600 Acceptability of Printed Wiring Boards (default class 2)
IPC-6011 Generic Performance Specification for Printed Wiring Boards
IPC-6012 Qualification and Performance specs. (default class 2)
IPC-TM-650 Test methods manual.
IPC-SM-840 Qualification and Performance of permanent polymer coatings
IPC-4101 Specification for base materials rigid / multi-layer
MIL-PFR-55110 Military Performance and Specifications-Tucson
IPC-6018 Microwave End Product Board Inspection and Test-Tucson

Please send us your inquiry through our inquiry form or via email to PCB@eu.kagafei.com