Origami Module Products

  • Overview
  • Origami Module M20
  • Origami Module B20
  • Origami Carrier B21

Origami Module

Origami Module M20, Origami Module B20 and Origami Carrier B21 are currently in our portfolio as FPGA Modules from Inrevium.

Features of Origami Module M20:

  • Interfaces:
    • Connector Samtec Z-Ray A8
    • 1150 pins (23 x 50)
    • 16 bidirectional GT @ 25 Gbps
    • 48 LVDS @ 1.2 Gbps
    • JTAG
    • I²C & SPI control bus
    • Power lines LEDs for debug
    • Up to 400 Gb/sec parallel data

Picture of the Origami Module M20

  • Dimensions and weight:
    • Board alone: 52.6 x 62.6 x 10 mm – 32 g
    • Board with heatsink: 52.6 x 62.6 x 25 mm – 90 g
Power Input:8-16V
Clocks:25 MHz + 4 Programmable clocks
FPGA:Xilinx Kintex UltraScale Plus: KU3P or KU5P in FFVB676 package
Memory:2x 8Gbit (2x 4Gbit optional), 32-bit data bus
Embedded Power Rails:DC/DC converters
Flash memory:1x QSPI, 4-bit data bus

picture 2 Origami Module M20

Origami Module B20

The Origami B20 Module is a production module with extreme connectivity and processing power.

With its business card size and its dedicated Z-Ray connector, the B20 can easily be integrated onto standard (as B21 or C21) or custom carrier boards to perfectly fit every application.

The B20 evolves around a Xilinx Kintex Ultrascale 060 FPGA. The B20 features 2 banks of high bandwidth DDR4 memories. It incorporates on-board DC-DC converters.

This module offers special provision for security. It allows to secure IP-Cores, Firmware and processed content with strong encryption, key management and physical security enclosure. It includes a battery powered real time clock and tamper detection circuitry with FPGA bitstream encryption.

The B20 is particularly convenient for advanced video applications. It is capable of handling multiple video codecs and of interfacing and processing video streams up to 8K UHD-2 in uncompressed & TICO and up to 4K UHD-1 in uncompressed, TICO, JPEG 2000, HEVC IP, AVC and MPEG 2.

Using its extreme connectivity, the B20 is made to support up to100Gigabit Ethernet and future 24G-SDI streams.

Part Number: OM-B20-Z2-KU-060

Features

  • Interfaces
    • Interposer connector – 2 units Module (Z2-50)
      • 23 x 50 pins
      • 28x Gigabit Transceivers
      • JTAG
      • HPIO / HRIO
      • I²C & ISP control bus
      • 12V & 3,3V Power lines
    • LEDs for debug
  • Security
    • RTC with battery back-up
    • Tamper Detection on Security Enclosure
    • FPGA encryption
  • On board Clock
    • 200 Mhz Oscillator +- 30ppm
    • 300 MHz Oscillator +- 10ppm
  • FPGA
    • Xilinx Kintex UltraScale:
    • XCKU060 -2 speed grade in FFVA1156 package
  • Memory
    • 4GByte DDR4 SDRAM: 16Gbits per bank
    • 2 banks x (4 chips x 256Mbits depth x 16 width)
  • Flash Memory
    • 1 Gbit Configurable flash
  • Dimension 2 Unit Origami Module
    • 75 x 52.60 x 20 mm

picture of origami module b20

Origami Carrier B21

The Origami B21 Carrier offers a flexible PCIe platform to experiment and deploy fast and efficiently high end video applications using the extreme power and connectivity of the Origami B20 Module.

With its half-height half-length low pro¬ le PCIe size, the B21 can easily be integrated into any PC based systems.

Featuring a PCIe GEN3 x8/x16 bus, the B21 can reach throughput supporting up to uncompressed 8K-60p video streams simultaneously as input and output.

With its 3 SFP+ cages, the B21 allows interfacing through 12G-SDI, HDMI, 10 Gb Ethernet, in copper or fibre version.

Coupled with the Origami B20 Module, the B21 is particularly convenient for advanced video applications. It is capable of handling multiple video codecs and of interfacing and processing video streams up to 8K UHD-2 in uncompressed & TICO and up to 4K UHD-1 in uncompressed, TICO, JPEG 2000, HEVC IP, AVC and MPEG 2.

Part Number: OC-B21-Z2-PC16-SFP3

Reference Designs & Development Kits

A set of development kits are available (under license) to help you develop your own carrier board:

  • Hardware Development Kit (HDK)
    • Interposer schematics, PCB layout
    • Interposer reference design and pinout
    • Reference design, Bill of Materials
  • Software Development Kit (SDK)
    • API
  • Firmware Development Kit (FDK)
    • Pre-validated IP-cores and pre-build ¬firmwares
    • Tool to develop firmwares in HLS

Features

  • Interfaces
    • 3x SFP+ Cages – MSA and Embrionix compliant
    • PCIe Gen3 up to x16
    • Interposer connector Z2-50 for 1×2 units or 2×1 unit
    • Origami Module(s)
      • 6x Gigabit Transceivers toward the 3 SFP Cages
      • 16x Gigabit Transceivers toward the PCIe bus
      • JTAG
      • HPIO / HRIO
      • I²C & ISP control bus
      • 12V & 3,3V Power lines
    • USB and JTAG connectors for module programming
    • Reset buttons and LEDs for debug
  • Clock
    • 2x Clock Generators AD9578
    • 1x Clock Generator CDCM6208
  • Dimension
    • Low Profile – Half length – PCIe card
    • 90 x 167.65 mm

Picture of Origami Carrier B21

Supplier Profile

Company overview

by Tokyo Electron Device Ltd

  • Company name: Tokyo Electron Device Ltd
  • Foundation: inrevium – since 2004
  • Headquarter: Yokohama, Japan
  • FY2014 Net Sales: ¥ 101,801 Million
  • Products: FPGA Evaluation Boards & Platform Solutions, Market Specific IP, Design Service
  • Company home page: http://solutions.inrevium.com/